XFMEXPRESS™ |
PCIe® / NVMe™ Storage Device

New Technology for Removable PCIe® Attached, NVMe™ Memory Devices

With an unparalleled combination of features, XFMEXPRESS™ is designed to revolutionize storage in ultra-mobile PCs, IoT devices and embedded applications. Offered in a small removable form factor, XFMEXPRESS™ supports PCIe® and NVMe™ interfaces and is compatible with the new JEDEC XFM Device Ver.1.0 global standard published in August, 2021. In addition, XFMEXPRESS™ can be used with a clamshell socket and mounted directly on a PCB.

KIOXIA’s XFMEXPRESS™ can be used as a serviceable storage device. Serviceability provides the ability to easily upgrade, replace or repair the device and it provides an expansion capability. XFMEXPRESS™ requires both less area and volume than other removable devices.

Key Features of KIOXIA XFMEXPRESS™

  • Small embedded & removable PCIe®/ NVMe™ storage for compact host devices
  • Removable design with a hinge connector and screwless clamshell type of socket
  • Easy to remove and address serviceability requirements
  • Smaller and thinner than the M.2 form factor
  • Reduces configuration management
  • Supports PCIe®/ NVMe™ — a standard SoC interface
  • Compliant with JEDEC Standard XFM Device Ver.1.0

Applications

  • IoT Devices
  • 5G Devices
  • Industry 4.0
  • AR/VR Devices
  • Notebook PC / Table PC
  • Portable Storage
  • Surveillance Cameras
  • Gaming

Dimensions

18mm x 14mm x 1.4mm

Why XFMEXPRESS™?

KIOXIA’s XFMEXPRESS™ can be used as a serviceable storage device. Serviceability provides the ability to easily upgrade, replace or repair the device and it provides an expansion capability. XFMEXPRESS™ requires both less area and volume than other removable devices.

Serviceability

Using a clamshell type of socket, the XFMEXPRESS™ removable storage device can be easily mounted, removed or replaced on the PCB. The clamshell type of socket snaps into place and provides a tight and secure mount (no tools required).

1. Slide the cover to unlock

2. Open the cover

3. Insert XFM device in cover

4. Close the cover

5. Slide the cover to lock

6. Paired condition

Removable design concept provided by Japan Aviation Electronics Industry, Limited.

XFMEXPRESS™ Key Technology

New Global Standard

XFMEXPRESS™ offers a new removable form factor compliant with the JEDEC standard XFM Device Ver.1.0.  The clamshell type of socket is compliant with the XFM device standard and securely snaps into place a without tools.

Compact Foot Print

W 14 x L 18 (mm) and Low profile: 1.4 (mm). Smaller than M.2 2230 form factor. Same form factor for all capacities (128GB-1024GB)

PCIe® / NVMe™ Interface Compliant

XFMEXPRESS™ is compliant with PCIe® 4.0 and NVMe™ 1.4b standards and uses common device drivers. Proprietary device drivers are not required.

Heat Dissipation Performance

Designed with Thermal interface Material (TIM), XFMEXPRESS™ provides efficient heat dissipation performance.

KIOXIA XFMEXPRESS™ Key Applications

Notebook / Ultrabook™ / Tablet

Smart TV / Virtual Reality Headsets / Set-Top-Box / Digital Video Recorder

Learn and Evaluate

XFMEXPRESS™ Specs

*Table can be scrolled horizontally.

Capacity Part Number Standard and dimensions Interface

Command

Protocol

DRAM HMB Power
Power Supply Power State

Operating

Temperature

APST
128GB GNB3CC128GCB1 JEDEC
XFM Device
Spec V.1.0 compliant

14x18x1.4 mm
PCIe® Gen4
x 2 Lanes
NVMe™ 1.4 None Support 2.5 / 1.2 VDC OPS: PS0, PS1, PS2

NOPS: PS3, PS4
0°C~80°C Support
256GB GNB3CC256GCB1
512GB GNB3CC512GCB1
1,024GB GNB3CC001TCB1
  • PCI Express Base Specification Revision 4.0, Version 1.0 (September 27, 2017)
  • NVM Express Base Specification Revision 1.4b (September 21, 2020)
  • PCI Express M.2 Specification Revision 4.0, Version 1.0 (November 5, 2020)
  • JEDEC STANDARD, XFM Device Version 1.0, JESD233 (August 2021)
  • XFMEXPRESS is a trademark of KIOXIA Corporation.
  • PCI-SIG, PCI Express and PCIe are registered trademarks of PCI-SIG.
  • NVMe is a trademark of NVM Express, Inc.
  • Any other company names, product names, and service names may be trademarks of their respective companies.
  • Connector design is developed by JAE (Japan Aviation Electronics Industry, Ltd.)
  • Product image may differ from the actual product.
  • Read and write speed may vary depending on the host device, read and write conditions, and file size.
  • Product density is identified based on the density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application. For details, please refer to applicable product specifications. The definition of 1GB = 230 bytes = 1,073,741,824.

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Contact

Please contact us if you have any technical questions, requests for materials, are interested in samples or purchases of business products (Memory, SSD), etc.