KIOXIA to expand its Kitakami plant site to increase flash memory production capacity further

KIOXIA Europe GmbH, (formerly Toshiba Memory Europe GmbH) announced it will be expanding its Kitakami Plant site in Iwate Prefecture, Japan to further increase production capacity of its proprietary 3D Flash memory BiCS FLASH. The 136,000 square meter area adjacent to the current site will create room for the future construction of the company's "K2" manufacturing facility, with site preparation work to commence in spring of 2021 and be completed by spring of 2022.

Due to technological innovation, the amount of data being generated, stored and used around the world has increased exponentially. The flash memory market is expected to continue to grow, driven by cloud services, 5G, IoT, AI, and automated driving. This expansion will ensure KIOXIA continues to meet the increasing demand for memory around the world.

Today's news follows the company's recent announcement that it will also be constructing Fab 7 at its Yokkaichi Plant in Mie Prefecture beginning in spring of 2021, further boosting KIOXIA's production capacity by introducing an advanced manufacturing system that utilizes AI.

Under its mission of uplifting the world with memory, KIOXIA is focused on cultivating the new era of memory. KIOXIA remains committed to enhancing its position in the memory industry through capital investment and research and development that reflect market trends.

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About KIOXIA Europe GmbH

KIOXIA Europe GmbH (formerly Toshiba Memory Europe GmbH) is the European based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid state drives (SSDs). From the invention of flash memory to today's breakthrough BiCS FLASH 3D technology, KIOXIA continues to pioneer cutting-edge memory solutions and services that enrich people's lives and expand society's horizons. The company's innovative 3D flash memory technology, BiCS FLASH, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive and data centers.