Bild bg7
Bild bg7 (M.2 Typ 2230-S2)
Bild bg7 (M.2 Typ 2242-S2)
Bild bg7 (M.2 Typ 2280-S2)

Client-NVMe™-SSD

Die BG7-Serie von KIOXIA ist eine Produktreihe aus kompakten NVMe™-SSDs mit Kapazitäten von bis zu 2.048 GB, die eine mit der PCIe® 4.0- und NVMe™ 2.0d-Spezifikation konforme Schnittstelle und KIOXIA BiCS FLASH™ TLC-Flashspeicher der 8. Generation* nutzen. Mit höherer Bandbreite, verbesserter Flashverwaltung und Host Memory Buffer (HMB)-Technologie bieten die SSDs der BG7-Serie eine sehr hohe Leseleistung für SSDs mit kompaktem Formfaktor von bis zu 7.000 MB/s (sequentielles Lesen) und bis zu 1.000 KIOPS (zufälliges Lesen).

Die SSDs der BG7-Serie von KIOXIA sind in den Kapazitäten 256, 512, 1.024 GB und 2.048 GB und in den Modulformfaktoren M.2 Typ 2230, Typ 2242 und Typ 2280 erhältlich, wodurch sie sich für dünne und leichte Systemdesigns, wie ultradünne und AI-PCs, eignen. Die SSDs der BG7-Serie sind optional als SED-Modelle (Self-Encrypting Drive) mit Unterstützung für TCG Opal Version 2.01 erhältlich.

  • Dokumente BiCS FLASH™ TLC-Flashspeicher der 6. Generation von KIOXIA für BG7-SSDs mit einer Speicherkapazität von 256 GB

Dokumente

Hauptmerkmale

  • BiCS FLASH™ TLC-Flashspeicher der 8. Generation von KIOXIA (BiCS FLASH™ TLC-Flashspeicher der 6. Generation von KIOXIA für 256 GB)
  • PCIe® 4.0, NVMe™ 2.0d-konform
  • Speicherkapazitäten bis zu 2.048 GB
  • Einseitige Formfaktoren M.2 Typ 2230, Typ 2242 und Typ 2280
  • TCG OPAL 2.01 SED-Option

Schlüsselanwendungen

  • Ultramobile PCs
  • KI-PCs
  • 2-in-1-Notebook-PCs

* Table can be scrolled horizontally.

Base Model NumberKBG70ZNS2T04KBG70ZNS1T02KBG70ZNS512GKBG70ZNS256G
SED Model NumberKBG7BZNS2T04KBG7BZNS1T02KBG7BZNS512GKBG7BZNS256G
Capacity2,048 GB1,024 GB512 GB256 GB
Basic Specifications
Form FactorM.2 2230-S3 Single-sidedM.2 2230-S2 Single-sided
lnterfacePCIe® 4.0, NVMe™ 2.0d
Maximum Interface Speed64 GT/s (PCIe® Gen4 x4)
Flash Memory TypeBiCS FLASH™ TLC
Performance (Up to)
Sequential Read7,000 MB/s6,400 MB/s
Sequential Write6,000 MB/s5,000 MB/s4,000 MB/s
Random Read1,000 KIOPS850 KIOPS550 KIOPS500 KIOPS
Random Write1,000 KIOPS920 KIOPS850 KIOPS
Power Requirements
Supply Voltage3.3 V ± 5 %
Power Consumption (Active)4.5 W typ.
Power Consumption (L1.2 mode)3.0 mW typ.
Reliability
MTTF2,000,000 hours
TBW1,200600300150
Dimensions
Thickness2.38 mm Max2.23 mm Max
Width22 mm ± 0.15 mm
Length30 mm ± 0.15 mm
Weight3.2 g Max
Environmental
Temperature (Operating)0 ℃ to 85 ℃
Temperature (Non-operating)-40 ℃ to 85 ℃
Humidity (Operating)0 % to 90 % R.H.
Vibration (Operating)196 m/s2 { 20 Grms } ( 20 to 2,000 Hz )
Shock (Operating)14.7 km/s2 { 1,500 G } ( 0.5 ms )
M.2 Typ 2242-S2/-S3 einseitig

* Table can be scrolled horizontally.

Base Model NumberKBG70ZNT2T04KBG70ZNT1T02KBG70ZNT512GKBG70ZNT256G
SED Model NumberKBG7BZNT2T04KBG7BZNT1T02KBG7BZNT512GKBG7BZNT256G
Capacity2,048 GB1,024 GB512 GB256 GB
Basic Specifications
Form FactorM.2 2242-S3 Single-sidedM.2 2242-S2 Single-sided
lnterfacePCIe® 4.0, NVMe™ 2.0d
Maximum Interface Speed64 GT/s (PCIe® Gen4 x4)
Flash Memory TypeBiCS FLASH™ TLC
Performance (Up to)
Sequential Read7,000 MB/s6,400 MB/s
Sequential Write6,000 MB/s5,000 MB/s4,000 MB/s
Random Read1,000 KIOPS850 KIOPS550 KIOPS500 KIOPS
Random Write1,000 KIOPS920 KIOPS850 KIOPS
Power Requirements
Supply Voltage3.3 V ± 5 %
Power Consumption (Active)4.5 W typ.
Power Consumption (L1.2 mode)3.0 mW typ.
Reliability
MTTF2,000,000 hours
TBW1,200600300150
Dimensions
Thickness2.38 mm Max2.23 mm Max
Width22 mm ± 0.15 mm
Length42 mm ± 0.15 mm
Weight3.8 g Max
Environmental
Temperature (Operating)0 ℃ to 85 ℃
Temperature (Non-operating)-40 ℃ to 85 ℃
Humidity (Operating)0 % to 90 % R.H.
Vibration (Operating)196 m/s2 { 20 Grms } ( 20 to 2,000 Hz )
Shock (Operating)14.7 km/s2 { 1,500 G } ( 0.5 ms )
M.2 Typ 2280-S2/-S3 einseitig

* Table can be scrolled horizontally.

Base Model NumberKBG70ZNV2T04KBG70ZNV1T02KBG70ZNV512GKBG70ZNV256G
SED Model NumberKBG7BZNV2T04KBG7BZNV1T02KBG7BZNV512GKBG7BZNV256G
Capacity2,048 GB1,024 GB512 GB256 GB
Basic Specifications
Form FactorM.2 2280-S3 Single-sidedM.2 2280-S2 Single-sided
lnterfacePCIe® 4.0, NVMe™ 2.0d
Maximum Interface Speed64 GT/s (PCIe® Gen4 x4)
Flash Memory TypeBiCS FLASH™ TLC
Performance (Up to)
Sequential Read7,000 MB/s6,400 MB/s
Sequential Write6,000 MB/s5,000 MB/s4,000 MB/s
Random Read1,000 KIOPS850 KIOPS550 KIOPS500 KIOPS
Random Write1,000 KIOPS920 KIOPS850 KIOPS
Power Requirements
Supply Voltage3.3 V ± 5 %
Power Consumption (Active)4.5 W typ.
Power Consumption (L1.2 mode)3.0 mW typ.
Reliability
MTTF2,000,000 hours
TBW1,200600300150
Dimensions
Thickness2.38 mm Max2.23 mm Max
Width22 mm ± 0.15 mm
Length80 mm ± 0.15 mm
Weight6.3 g Max
Environmental
Temperature (Operating)0 ℃ to 85 ℃
Temperature (Non-operating)-40 ℃ to 85 ℃
Humidity (Operating)0 % to 90 % R.H.
Vibration (Operating)196 m/s2 { 20 Grms } ( 20 to 2,000 Hz )
Shock (Operating)14.7 km/s2 { 1,500 G } ( 0.5 ms )
  • Product image may represent a design model.
  • Availability of the SED model line-up may vary by region.
  • Definition of capacity: KIOXIA Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1 GB = 2^30 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
  • IOPS: Input Output Per Second (or the number of I/O operations per second).
  • TBW: Terabytes Written. The number of terabytes that may be written to the SSD for the specified lifetime.
  • Read and write speed, tested on the state of "Host Memory Buffer (HMB) = On", may vary depending on the host device, read and write conditions, and file size.
  • Read and write speed may vary depending on various factors such as host devices, software (drivers, OS etc.), and read/write conditions.
  • MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF.
  • PCIe is a registered trademark of PCI-SIG.
  • NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.
  • Other company names, product names, and service names may be trademarks of third-party companies.
  • All information provided here is subject to change without prior notice.

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