Imagem de xg6_001

Cliente SSD
NVMe™ SSD M.2

A série XG6 utiliza a mais recente memória flash KIOXIA 3D TLC (3 bits por célula) de 96 camadas. Com funcionalidades de cache de 4ª geração BiCS FLASH™ e SLC, as SSD XG6 atingem velocidades de leitura/escrita sequenciais de 3180 MB/s e 2960 MB/s, respetivamente, e oferecem até 355.000 IOPS de leitura aleatória e 365.000 IOPS de escrita aleatória. Além do alto desempenho, a XG6 continua o design de baixa potência da família XG, consumindo 4,7 W ou menos no modo ativo e menos de 3 mW no modo de pausa.

A nova série XG6 está otimizada para PCs móveis sensíveis à energia, PCs de jogo orientados para o desempenho, bem como ambientes de centros de dados para arranque, cache e registo de servidores.
Disponível num formato de face única compacto M.2 2280, a série XG6 está disponível em três modelos de capacidade de 256 GB, 512 GB e 1024 GB, cada um com a opção de um modelo de Unidade Auto-Encriptada (SED) compatível com TCG Opal Versão 2.01.

Documentos

Características principais

KIOXIA BiCS FLASH™ de 96 camadas

PCIe® Gen3 x4, NVMe™

Capacidade até 1.024 GB

M.2 2280 unilateral

TCG OPAL 2.01 Opcional para SED

Aplicações-chave

  • Computadores portáteis de desempenho fino
  • Computadores de secretária de alto desempenho
  • Computadores para jogos
  • Utilização de &registo em cache, de arranque do servidor no centro de dados

Especificações

* Table can be scrolled horizontally.

Model Number(Non-SED)KXG60ZNV1T02KXG60ZNV512GKXG60ZNV256G
Model Number(SED)KXG6AZNV1T02KXG6AZNV512GKXG6AZNV256G
Capacity1,024 GB512 GB256 GB
Basic Specifications
Form FactorM.2 2280-S2 Single-sided
Connector TypeM.2 M
lnterfacePCIe® Gen3 x4, NVMe™ 1.3a
lnterface Speed32 GT/s (Gen3 x4)
Flash Memory TypeBiCS FLASH™ TLC
Sequential Read3,180 MB/s3,100 MB/s3,050 MB/s
Sequential Write2,960 MB/s2,800 MB/s1,550 MB/s
Power Requirements
Supply Voltage3.3 V ± 5 %
Power Consumption (Active)4.7 W typ.4.1 W typ.4 W typ.
Power Consumption (L1.2 mode)3 mW typ.
Reliability
MTTF1,500,000 hours
Dimensions
Height2.23 mm
Width22.0 mm
length80.0 mm typ.
Weight7.3 g typ.7.0 g typ.
Environmental
Temperature (Operating)0 ~ 95 °C (Controller Temperature)
Temperature (Operating)0 ~ 85 °C (Other Components Temperature)
Temperature(Non-operating)-40 ~ 85 °C
Vibration (Operating/Non-operating)196 m/s2 { 20 G } ( Peak, 10 ~ 2,000 Hz )
Shock (Operating/Non-operating)14.7 km/s2 { 1,500 G } ( 0.5 ms )
More features・Sanitize command is supported.
・Namespace Management and Namespace Attachment commands are supported.
・Non-Operational Power State Configuration is supported.
・TCG Storage Interface Interactions Specification (SIIS) Version 1.07 is supported.
  • Product image may represent a design model.
  • Availability of the SED model line-up may vary by region.
  • Definition of capacity: KIOXIA Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 2^30 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
  • MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF.
  • Read and write speed, tested on the state of "SLC cache=ON", may vary depending on the host device, read and write conditions, and file size.
  • PCIe is a registered trademark of PCI-SIG.
  • NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.
  • Other company names, product names, and service names may be trademarks of their respective companies.

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