Imagem de xg8_001

Cliente SSD
NVMe™ SSD M.2

A Série XG8 utiliza a mais recente memória flash KIOXIA 3D TLC (3 bits por célula) de 112 camadas. Com as funcionalidades de cache de 5ª geração BiCS FLASH™ e SLC, as SSD XG8 atingem velocidades de leitura/escrita sequenciais de 7000 MB/s e 5800 MB/s, respetivamente, e oferecem até 900K IOPS de leitura aleatória e 620K IOPS de escrita aleatória. O consumo de energia da Série XG8 é de 8,1 W ou menos no modo ativo e inferior a 3 mW no modo de pausa.

A nova Série XG8 foi otimizada para PCs móveis sensíveis à energia, PCs de jogo orientados para o desempenho, bem como ambientes de centros de dados para arranque de servidores, armazenamento em cache e registo.

Disponível num formato compacto M.2 Tipo 2280, a série XG8 está disponível em quatro modelos de capacidade de 512 GB, 1024 GB, 2048 GB e 4096 GB, cada um com a opção de um modelo de unidade auto-encriptadora (SED) compatível com TCG Opal Versão 2.01.

Documentos

Características principais

KIOXIA 112-Layer BiCS FLASH™

KIOXIA BiCS FLASH™ de 112 camadas

PCIe® 4.0, NVMe™1.4

PCIe® 4.0, NVMe™1.4

Capacities up to 4,096 GB

Capacidade até 4.096 GB

M.2 Type 2280 Single-sided (512 GB, 1,024 GB, 2,048 GB) / Double-sided(4,096 GB)

M.2 Tipo 2280 de face única (512 GB, 1024 GB, 2048 GB) / face dupla (4096 GB)

TCG Opal 2.01 Optional for SED

TCG OPAL 2.01 Opcional para SED

Aplicações-chave

  • Computadores portáteis de desempenho fino
  • Computadores de secretária de alto desempenho
  • Computadores para jogos
  • Utilização de arranque do servidor & colocação em cache e registo no centro de dados

Especificações

* Table can be scrolled horizontally.

Base Model NumberKXG80ZN84T09KXG80ZNV2T04KXG80ZNV1T02KXG80ZNV512G
SED Model NumberKXG8AZN84T09KXG8AZNV2T04KXG8AZNV1T02KXG8AZNV512G
Capacity4,096 GB2,048 GB1,024 GB512 GB
Basic Specifications
Form FactorM.2 2280-D2 Double-sidedM.2 2280-S2 Single-sided
Connector TypeM.2 M
lnterfacePCIe® 4.0, NVMe™ 1.4
Maximum Interface Speed64 GT/s ( Gen4 x4 )
Flash Memory TypeBiCS FLASH™ TLC
Sequential Read7,000 MB/s
Sequential Write5,800 MB/s5,600 MB/s5,000 MB/s
Power Requirements
Supply Voltage3.3 V ± 5 %
Power Consumption (Active)8.1 W typ.7.7 W typ.
Power Consumption (L1.2 mode)3.0 mW typ.
Reliability
MTTF1,500,000 hours
Dimensions
Height3.58 mm Max2.23 mm Max
Width22.0 ± 0.15 mm
Length80.0 ± 0.15 mm
Weight8.3 g Max7.1 g Max6.8 g Max6.6 g Max
Environmental
Temperature (Operating)0 °C to 95 °C (Controller Temperature)
Temperature (Operating)0 °C to 85 °C (Other Components Temperature)
Temperature (Non-operating)-40 °C to 85 °C
Humidity (Operating)0 % R.H. to 90 % R.H.
Vibration (Operating/Non-operating)196 m/s2 { 20 G } ( Peak, 20 to 2,000 Hz )
Shock (Operating)14.7 km/s2 { 1,500 G } ( 0.5 ms )
  • Product image may represent a design model.
  • Availability of the SED model line-up may vary by region.
  • Definition of capacity: KIOXIA Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1 GB = 2^30 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
  • MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF.
  • Read and write speed, tested on the state of "SLC cache=ON", may vary depending on the host device, read and write conditions, and file size.
  • PCIe is a registered trademark of PCI-SIG.
  • NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.
  • Other company names, product names, and service names may be trademarks of their respective companies.

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