Image of xg6-p_001

NVMe™ SSD pour clients

Profitant de la mémoire flash BiCS FLASH™ 3D TLC (3 bits par cellule) de KIOXIA, KIOXIA XG6-P séries offrent une haute capacité de stockage, tout en tenant la promesse d’un stockage ultra-fin, à haute vitesse avec une efficacité énergétique exceptionnelle.

Cette série est parfaite pour la production de vidéos et de contenus nécessitant un accès haute vitesse à des données haute-capacité, pour les applications d’apprentissage automatique et d’IA, pour les stations de travail et les PC haut de gamme.
La série XG6-P atteint une performance d’écriture séquentielle de 2 920 Mo/s, ce qui représente 32,7 % d’amélioration par rapport à notre modèle premium de la génération précédente, la série XG5-P.
Le SSD XG6-P 2 048 Go est disponible en face unique avec facteur de forme M.2 2280 (22 x 80 mm) et offre des options de sécurité incluant l’assistance TCG Pyrite en version 1.0. pour les configurations non-SED (Self-Encrypting Drive) et la version 2.01 de TGC Opal pour SED.

Documents

Principales caractéristiques

  • BiCS FLASH™ 96 couches de KIOXIA
  • PCIe® Gen3 x4, NVMe™
  • Capacité : 2 048 Go
  • M.2 2280 à une seule face
  • TCG OPAL 2.01 en option pour SED

Applications principales

  • PC postes de travail
  • PC haut de gamme
  • Production de contenus et vidéos
  • IA/Apprentissage automatique

Spécifications

* Table can be scrolled horizontally.

Base Model NumberKXG60PNV2T04
SED Model NumberKXG6APNV2T04
Capacity2,048 GB
Basic Specifications
Form FactorM.2 2280-S2 Single-sided
lnterfacePCIe® 3.0, NVMe™ 1.3a
Maximum Interface Speed32 GT/s (PCIe® Gen3 x4)
Flash Memory TypeBiCS FLASH™ TLC
Performance (Up to)
Sequential Read3,180 MB/s
Sequential Write2,920 MB/s
Random Read355K IOPS
Random Write365K IOPS
Power Requirements
Supply Voltage3.3 V ± 5 %
Power Consumption (Active)4.9 W typ.
Power Consumption (L1.2 mode)3.0 mW typ.
Reliability
MTTF1,500,000 hours
TBW600
Dimensions
Thickness2.23 mm Max
Width22.0 mm ± 0.15 mm
Length80.0 mm ± 0.15 mm
Weight7.3 g Max
Environmental
Temperature (Operating)0 ℃ to 95 ℃ (Controller Temperature)
Temperature (Operating)0 ℃ to 85 ℃ (Other Components Temperature)
Temperature (Non-operating)-40 ℃ to 85 ℃
Humidity (Operating)0 % to 90 % R.H.
Vibration (Operating)196 m/s2 { 20 Grms } ( 20 Hz to 2,000 Hz )
Shock (Operating)14.7 km/s2 { 1,500 G } ( 0.5 ms )
  • Product image may represent a design model.
  • Availability of the SED model line-up may vary by region.
  • Definition of capacity: KIOXIA Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1 GB = 2^30 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
  • MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF.
  • TBW: Terabytes Written. The number of terabytes that may be written to the SSD for the specified lifetime.
  • Read and write speed, tested on the state of "SLC cache=ON", may vary depending on the host device, read and write conditions, and file size.
  • PCIe is a registered trademark of PCI-SIG.
  • NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.
  • Other company names, product names, and service names may be trademarks of third-party companies.

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