Immagine di bg6_001

SSD NVMe™ client

La serie KIOXIA BG6 è una gamma di SSD NVMe™ con fattore di forma compatto e capacità fino a 2.048 GB, che sfrutta un'interfaccia conforme alle specifiche PCIe®4.0, NVMe™ 1.4c e una memoria flash BiCS FLASH™ 3D TLC di generazione 6*. Grazie a una maggiore larghezza di banda, a una migliore gestione della memoria flash e alla tecnologia Host Memory Buffer (HMB), le unità SSD della serie BG6 offrono prestazioni di lettura molto elevate per le unità SSD a fattore di forma compatto, fino a 6.000 MB/s (lettura sequenziale) e fino a 900K IOPS (lettura casuale).

Le unità SSD KIOXIA BG6 Series sono disponibili con capacità di 256 GB, 512 GB, 1.024 GB e 2.048 GB nei fattori di forma M.2 Type 2230 e Type 2280, che le rendono adatte a sistemi sottili e leggeri, come i PC ultrasottili. La serie BG6 offre un'opzione di modello SED (Auto-Encrypting Drive), che supporta la versione 2.01 di TCG Opal.

  • Memoria flash TLC KIOXIA BiCS FLASH™ generazione 5 per SSD BG6 con capacità di 256 GB e 512 GB

Documenti

Caratteristiche principali

  • Memoria flash TLC KIOXIA BiCS FLASH™ generazione 6 (Memoria flash TLC KIOXIA BiCS FLASH™ generazione 5 per 256 GB e 512 GB)
  • Conforme alle specifiche PCIe® 4.0, NVMe™ 1.4c
  • Capacità fino a 2.048 GB
  • Fattori di forma a lato singolo M.2 di tipo 2230 e 2280
  • TCG Opal 2.01 opzione SED
     

Applicazioni principali

  • PC ultra-mobili
  • PC notebook 2 in 1

Specifiche

Fattore di forma modulo M.2 Tipo 2230

* Table can be scrolled horizontally.

Base Model NumberKBG60ZNS2T04KBG60ZNS1T02KBG60ZNS512GKBG60ZNS256G
SED Model NumberKBG6AZNS2T04KBG6AZNS1T02KBG6AZNS512GKBG6AZNS256G
Capacity2,048 GB1,024 GB512 GB256 GB
Basic Specifications
Form FactorM.2 2230-S3 Single-sidedM.2 2230-S2 Single-sided
lnterfacePCIe® 4.0, NVMe™ 1.4c
Maximum Interface Speed64 GT/s (PCIe® Gen4 x4)
Flash Memory TypeBiCS FLASH™ TLC
Performance (Up to)
Sequential Read6,000 MB/s4,800 MB/s4,400 MB/s
Sequential Write5,300 MB/s5,000 MB/s4,000 MB/s3,000 MB/s
Random Read900K IOPS650K IOPS350K IOPS
Random Write900K IOPS850K IOPS700K IOPS
Power Requirements
Supply Voltage3.3 V ± 5 %
Power Consumption (Active)4.4 W typ.4.3 W typ.4.7 W typ.4.3 W typ.
Power Consumption (L1.2 mode)3.0 mW typ.
Reliability
MTTF1,500,000 hours
TBW1,200600300150
Dimensions
Thickness2.38 mm Max2.23 mm Max
Width22 mm ± 0.15 mm
Length30 mm ± 0.15 mm
Weight3.0 g Max2.9 g Max2.8 g Max2.7 g Max
Environmental
Temperature (Operating)0 ℃ to 95 ℃ (Controller Temperature)
Temperature (Operating)0 ℃ to 85 ℃ (Other Components Temperature)
Temperature (Non-operating)-40 ℃ to 85 ℃
Humidity (Operating)0 % to 90 % R.H.
Vibration (Operating)196 m/s2 { 20 Grms } ( 20 to 2,000 Hz )
Shock (Operating)14.7 km/s2 { 1,500 G } ( 0.5 ms )
Fattore di forma modulo M.2 Tipo 2280

* Table can be scrolled horizontally.

Base Model NumberKBG60ZNV2T04KBG60ZNV1T02KBG60ZNV512GKBG60ZNV256G
SED Model NumberKBG6AZNV2T04KBG6AZNV1T02KBG6AZNV512GKBG6AZNV256G
Capacity2,048 GB1,024 GB512 GB256 GB
Basic Specifications
Form FactorM.2 2280-S3 Single-sidedM.2 2280-S2 Single-sided
lnterfacePCIe® 4.0, NVMe™ 1.4c
Maximum Interface Speed64 GT/s (PCIe® Gen4 x4)
Flash Memory TypeBiCS FLASH™ TLC
Performance (Up to)
Sequential Read6,000 MB/s4,800 MB/s4,400 MB/s
Sequential Write5,300 MB/s5,000 MB/s4,000 MB/s3,000 MB/s
Random Read900K IOPS650K IOPS350K IOPS
Random Write900K IOPS850K IOPS700K IOPS
Power Requirements
Supply Voltage3.3 V ± 5 %
Power Consumption (Active)4.4 W typ.4.3 W typ.4.7 W typ.4.3 W typ.
Power Consumption (L1.2 mode)3.0 mW typ.
Reliability
MTTF1,500,000 hours
TBW1,200600300150
Dimensions
Thickness2.38 mm Max2.23 mm Max
Width22 mm ± 0.15 mm
Length80 mm ± 0.15 mm
Weight6.0 g Max5.9 g Max5.8 g Max5.7 g Max
Environmental
Temperature (Operating)0 ℃ to 95 ℃ (Controller Temperature)
Temperature (Operating)0 ℃ to 85 ℃ (Other Components Temperature)
Temperature (Non-operating)-40 ℃ to 85 ℃
Humidity (Operating)0 % to 90 % R.H.
Vibration (Operating)196 m/s2 { 20 Grms } ( 20 to 2,000 Hz )
Shock (Operating)14.7 km/s2 { 1,500 G } ( 0.5 ms )
  • Product image may represent a design model.
  • Availability of the SED model line-up may vary by region.
  • Definition of capacity: KIOXIA Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1 GB = 2^30 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
  • IOPS: Input Output Per Second (or the number of I/O operations per second).
  • TBW: Terabytes Written. The number of terabytes that may be written to the SSD for the specified lifetime.
  • Read and write speed, tested on the state of "Host Memory Buffer (HMB) = On", may vary depending on the host device, read and write conditions, and file size.
  • Read and write speed may vary depending on various factors such as host devices, software (drivers, OS etc.), and read/write conditions.
  • MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF.
  • PCIe is a registered trademark of PCI-SIG.
  • NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.
  • Other company names, product names, and service names may be trademarks of third-party companies.
  • All information provided here is subject to change without prior notice.

Support

Download

You can download past product information, white papers, and data sheets, etc.

Introducing technical glossary related to KIOXIA's products and technology including semiconductor memory and SSD.

Contact

Please contact us if you have any technical questions, requests for materials, are interested in samples or purchases of business products (Memory, SSD), etc.