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Seria KIOXIA XD6 (E1.S)
Dysk SSD NVMe™ do centrów danych
Dyski SSD KIOXIA serii XD6 E1.S zostały zaprojektowane zgodnie ze specyfikacją Enterprise and Datacenter Standard Form Factor (EDSFF) E1.S, aby spełniać konkretne wymagania zastosowań hiperskalowych, w tym wymagania dotyczące wydajności, mocy i temperatury określone w specyfikacji dysku SSD NVMe™ Cloud Project (OCP). Zaprojektowane z myślą o optymalizacji gęstości i wydajności systemu dyski SSD serii XD6 stanowią przyszłość pamięci flash do serwerów i systemów pamięci masowej w zastosowaniach opartych na chmurze i hiperskalowych centrach danych.
Dokumenty
Najważniejsze cechy
Kluczowe zastosowania
- Serwery i systemy pamięci masowej do zastosowań chmurowych i hiperskalowych centrów danych
- Zgodność ze specyfikacjami PCIe® 4.0, NVMe™ 1.3c
- Obudowa E1.S, grubość 9,5 mm
- Opatentowana architektura firmy KIOXIA: sterownik, oprogramowanie układowe i pamięć flash 3D BiCS FLASH™
- Opcje pojemności 1,92 TB / 3,84 TB
- Ochrona przed utratą zasilania (PLP) i kompleksowa ochrona danych
- Opcja zabezpieczeń: SED (TCG-Opal 2.0)
Specyfikacje
* Table can be scrolled horizontally.
SED Model Number | KXD6CRJJ3T84 | KXD6CRJJ1T92 |
---|---|---|
Capacity | 3,840 GB | 1,920 GB |
Basic Specifications | ||
Form Factor | E1.S | |
lnterface | PCIe® 4.0, NVMe™ 1.3c | |
Maximum Interface Speed | 64 GT/s (PCIe® Gen4 x4) | |
Flash Memory Type | BiCS FLASH™ TLC | |
Performance (Up to) | ||
Sustained 128 KiB Sequential Read | 6,500 MB/s | |
Sustained 128 KiB Sequential Write | 2,350 MB/s | 1,200 MB/s |
Sustained 4 KiB Random Read | 880K IOPS | 660K IOPS |
Sustained 4 KiB Random Write | 90K IOPS | 50K IOPS |
Power Requirements | ||
Supply Voltage | 12 V ± 10 % | |
Power Consumption (Active) | 14 W typ. | 12 W typ. |
Power Consumption (Ready) | 5 W typ. | |
Reliability | ||
MTTF | 2,000,000 hours | |
DWPD | 1 | |
Dimensions | ||
Thickness | 9.5 mm ± 0.35 mm | |
Width | 33.75 mm ± 0.25 mm | |
Length | 118.75 mm ± 0.55 mm | |
Weight | 75 g Max | |
Environmental | ||
Temperature (Operating) | 0 °C to 70 °C | |
Temperature (Non-operating) | -40 °C to 85 °C | |
Humidity (Operating) | 5 % to 95 % R.H. | |
Vibration (Operating) | 21 m/s2 { 2.17 Grms } ( 7 Hz to 800 Hz ) | |
Shock (Operating) | 9.8 km/s2 { 1,000 G } ( 0.5 ms ) |
- Product image may represent a design model.
- Definition of capacity: KIOXIA Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1 GB = 2^30 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
- GT/s: Giga Transfers per second.
- A kibibyte (KiB) means 2^10, or 1,024 bytes.
- MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF.
- DWPD: Drive Writes Per Day. One full drive write per day means the drive can be written and re-written to full capacity once a day every day for the specified lifetime. Actual results may vary due to system configuration, usage and other factors.
- Read and write speed may vary depending on various factors such as host devices, software (drivers, OS etc.), and read/write conditions.
- IOPS: Input Output Per Second (or the number of I/O operations per second).
- SED optional model supports TCG Opal SSC except for some features. For more details, please make inquiries through “Contact us”.
- SED optional model is not available in all countries due to export and local regulations.
- PCIe is a registered trademark of PCI-SIG.
- NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.
- Other company names, product names, and service names may be trademarks of third-party companies.
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